MS-11e

Solder Paste Inspection Equipment by MIRTEC (5 more products)
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Product Specifications

Product Details

  • Part Number
    MS-11e
  • Manufacturer
    MIRTEC
  • Description
    PREMIUM 3D SPI FOR SMT/SEMI

General Parameters

  • Field of View
    32.17 x 32.17 mm
  • Air‑Pressure Requirements
    5 Kgf/cm2, 0.5 Mpa
  • Measurement
    Paste Height, Paste Area, Paste Volume, Bridge Detection, Offset, Shape Analysis
  • PCB Size
    460 x 510 mm
  • PCB Weight
    4 kg
  • Imaging Resolution
    10, 15 µm
  • Height Resolution
    ±1 μm
  • Camera
    4 MP
  • 3D Technology
    Shadow free
  • Inspection Type
    3D+2D
  • Bottom Clearance
    50 mm
  • Edge Clearance
    3 mm
  • Net Weight
    950 Kg
  • Overall Dimensions
    1080 x 1470 x 1500 mm
  • PCB Warpage
    ± 5 mm
  • Repeatability
    10 µm
  • Volume Repeatability
    ± 2%

Technical Documents
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