Mirage-D

Solder Paste Inspection Equipment by Shanghai JUTZE Intelligence Technology Co., Ltd (1 more product)

Note: Your request will be directed to Shanghai JUTZE Intelligence Technology Co., Ltd

Product Specifications

Product Details

  • Part Number
    Mirage-D
  • Manufacturer
    Shanghai JUTZE Intelligence Technology Co., Ltd
  • Description
    3D Inline Automated Solder Paste Inspection

General Parameters

  • Field of View
    40.9 x 30.7 mm
  • Defects
    Excessive Paste, Insufficient Paste, Bridge
  • Air‑Pressure Requirements
    0.5 Mpa
  • PCB Size
    510 x 590 mm
  • PCB Thickness
    0.6 to 6 mm
  • Imaging Speed
    330 ms/FOV
  • Camera
    4 MP, 12 MP
  • 3D Technology
    Shadow free
  • Inspection Type
    3D+2D
  • Lighting
    RGB+White LED ring lighting
  • X-Y Axis Resolution
    10 µm, 15 µm
  • Pc Interface
    SMEMA
  • Net Weight
    950 kg
  • Overall Dimensions
    1083 x 1445 x 1800 mm
  • PCB Warpage
    + 3 mm

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