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Solder Paste Inspection Equipment by Shenzhen Hetian Good Intelligent & Equipment Co., Ltd (1 more product)

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Product Specifications

Product Details

Part Number
SLE
Manufacturer
Shenzhen Hetian Good Intelligent & Equipment Co., Ltd

General Parameters

Field of View

48mm*40mm
Measurement

Area, volume, height, shape, offset, even tin
PCB Size

500mm×460mm
PCB Thickness

0.6mm~6mm
Imaging Speed

<0.7s
Camera

500 Mega Pixels
Max. Solder Height

0.2mm×0.2mm~12mm×12mm
Lighting

Surrounding RGB Light Source
Net Weight

750kg
Overall Dimensions

L(1090mm)×W(1290mm)×H(1534mm)

Technical Documents

Datasheet
Click To Download Brochure

View more details on the manufacturer's website

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