SLE

Solder Paste Inspection Equipment by Shenzhen Hetian Good Intelligent & Equipment Co., Ltd (1 more product)
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Product Specifications

Product Details

  • Part Number
    SLE
  • Manufacturer
    Shenzhen Hetian Good Intelligent & Equipment Co., Ltd
  • Description
    SLE/SLE-D is used to detect and monitor the quality of solder paste printing

General Parameters

  • Field of View
    48 x 40 mm
  • Air‑Pressure Requirements
    4 to 6 Kg/cm²
  • Measurement
    Paste Height, Paste Area, Paste Volume, Offset, Shape Analysis
  • PCB Size
    500 x 460 mm
  • PCB Thickness
    0.6 to 6 mm
  • Imaging Speed
    < 0.7 sec
  • Camera
    500 Mega Pixels
  • 3D Technology
    Shadow free
  • Inspection Type
    3D
  • Max. Solder Height
    0.2mm×0.2mm~12mm×12mm
  • Lighting
    Surrounding RGB Light Source
  • Pc Interface
    SMEMA
  • Net Weight
    750 kg
  • Overall Dimensions
    1090 x 1290 x 1534 mm
  • PCB Warpage
    < 2 mm
  • Repeatability
    1 µm
  • Volume Repeatability
    <10%

Technical Documents
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