GDK-S5

Solder Paste Inspection Equipment by Shenzhen HTGD Intelligent Equipment Co., Ltd (1 more product)
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Product Specifications

Product Details

  • Part Number
    GDK-S5
  • Manufacturer
    Shenzhen HTGD Intelligent Equipment Co., Ltd
  • Description
    3D Automatic Solder Inspecting Machine for LED/PCB Assembly

General Parameters

  • Field of View
    48 x 40 mm
  • Defects
    Offset, Shape Deformity, Insufficient Height
  • Air‑Pressure Requirements
    4 to 6 Kg/cm²
  • Measurement
    Offset, Paste Height, Paste Area, Paste Volume, Shape Analysis
  • PCB Size
    500 x 460 mm
  • PCB Thickness
    0.6 to 6 mm
  • Imaging Speed
    < 0.7 sec
  • Camera
    5 MP
  • 3D Technology
    Shadow free
  • Inspection Type
    3D+2D
  • Edge Clearance
    3 mm
  • Lighting
    RGB Light Source
  • X-Y Axis Resolution
    20 μm
  • Pc Interface
    SMEMA
  • Net Weight
    750 kg
  • Overall Dimensions
    1090 x 1290 x 1534 mm
  • PCB Warpage
    < 2 mm
  • Repeatability
    1 µm
  • Volume Repeatability
    <10%

Technical Documents
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