REFINE-XS

Solder Paste Inspection Equipment by Shenzhen JT Automation Equipment Co., Ltd. (3 more products)
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Product Specifications

Product Details

  • Part Number
    REFINE-XS
  • Manufacturer
    Shenzhen JT Automation Equipment Co., Ltd.
  • Description
    3D solder paste inspection based on white-lightsine stripe PMP technology

General Parameters

  • Field of View
    40 x 40 mm, 30 x 30 mm
  • Defects
    Excessive Paste, Insufficient Paste, Missing Paste, Bridge, Shape Deformity
  • Air‑Pressure Requirements
    4 to 6 bar, 5 L/min
  • Measurement
    Paste Height, Paste Area, Paste Volume
  • PCB Size
    460 x 410 mm
  • PCB Thickness
    0.5 to 5 mm
  • PCB Weight
    3 kg
  • Imaging Resolution
    20 µm, 15 µm
  • Imaging Speed
    0.35 sec/FOV
  • Height Resolution
    0.36 µm
  • Camera
    5 MP
  • 3D Technology
    Phase Measurement Profilometry
  • Top Clearance
    30 mm
  • Inspection Type
    3D
  • Bottom Clearance
    30 mm
  • Conveyor Height
    900 ± 20 mm
  • Lighting
    RGB+TOP
  • Pc Interface
    SMEMA
  • Net Weight
    950 kg
  • Overall Dimensions
    950 x 1320 x 1550 mm
  • PCB Warpage
    ± 3 mm
  • Repeatability
    <1% @3sigma
  • Volume Repeatability
    < 10% (@6 sigma tolerance = +/- 50%)

Technical Documents
View more details on the manufacturer's website
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