REFINE-L

Solder Paste Inspection Equipment by SunzonTech (3 more products)
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Product Specifications

Product Details

  • Part Number
    REFINE-L
  • Manufacturer
    SunzonTech
  • Description
    Online SMT SPI equipment SPI machine for PCB manufacturing

General Parameters

  • Field of View
    50 x 40 mm, 38 x 30 mm
  • Defects
    Excessive Paste, Insufficient Paste, Missing Paste, Bridge, Shape Deformity
  • Air‑Pressure Requirements
    0.5 Mpa
  • Measurement
    Paste Height, Paste Area, Paste Volume, Shape Analysis, Bridge Detection
  • PCB Size
    510 x 510 mm
  • PCB Thickness
    0.5 to 5 mm
  • PCB Weight
    3 kg
  • Imaging Resolution
    20 µm, 15 µm
  • Imaging Speed
    0.35 sec/FOV
  • Height Resolution
    0.36 µm
  • Camera
    5 MP
  • 3D Technology
    Phase Measurement Profilometry
  • Top Clearance
    30 mm
  • Inspection Type
    3D
  • Bottom Clearance
    30 mm
  • Conveyor Height
    900 ± 20 mm
  • Lighting
    RGB+TOP
  • Pc Interface
    SMEMA
  • Net Weight
    1200 kg
  • Overall Dimensions
    1080 x 1360 x 1600 mm
  • PCB Warpage
    ± 3 mm
  • Repeatability
    < 10%(@6 sigma tolerance-+/-50%)
  • Volume Repeatability
    < 1%@ 3sigma

Technical Documents
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