VCTA- V850

Solder Paste Inspection Equipment by SunzonTech (3 more products)
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Product Specifications

Product Details

  • Part Number
    VCTA- V850
  • Manufacturer
    SunzonTech
  • Description
    VCTA-V850/V850L Series 3D SMT SPI Solder paste inspection SMT SPI machine True color 3D SMT SPI

General Parameters

  • Field of View
    36 x 36 mm
  • Defects
    Offset, Height, Shape, Insufficient Paste
  • Air‑Pressure Requirements
    0.5 Mpa, 40 cm³/min
  • Measurement
    Paste Height, Paste Area, Paste Volume, Shape Analysis, Offset
  • PCB Size
    330 x 250 mm
  • PCB Thickness
    0.3 to 4.5 mm
  • Imaging Method
    True color 3D image
  • Imaging Resolution
    18 µm
  • Height Resolution
    0.37 µm
  • Camera
    High resolution telecentric industrial CCD lens
  • Inspection Type
    3D
  • Conveyor Height
    900 ± 20 mm
  • Lighting
    RGB ring LED light source
  • X-Y Axis Resolution
    <1 μm
  • Pc Interface
    SMEMA
  • Net Weight
    650 kg
  • Overall Dimensions
    950 x 960 x 1580 mm
  • PCB Warpage
    ± 5 mm
  • Repeatability
    <10%
  • Volume Repeatability
    < 1% @3sigma

Technical Documents
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