TR7007 SII Plus

Solder Paste Inspection Equipment by Test Research, Inc (33 more products)
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Product Specifications

Product Details

  • Part Number
    TR7007 SII Plus
  • Manufacturer
    Test Research, Inc

General Parameters

  • Field of View
    20 x 20 mm, 30 x 30 mm
  • Defects
    Insufficient Paste, Excessive Paste, Shape Deformity, Missing Paste, Bridge
  • Air‑Pressure Requirements
    0.6 Mpa
  • Measurement
    Paste Height, Paste Area, Paste Volume, Offset
  • PCB Size
    510 x 460 mm
  • PCB Thickness
    0.6 to 5 mm
  • PCB Weight
    3 kg
  • Imaging Method
    Dynamic Imaging
  • Imaging Resolution
    10 µm, 15 µm (factory setting)
  • Imaging Speed
    Up to 90 cm2/sec, Up to 200 cm2/sec
  • Height Resolution
    0.4 µm
  • Camera
    4 MP
  • 3D Technology
    Shadow free
  • Top Clearance
    25 mm
  • Inspection Type
    3D
  • Bottom Clearance
    40 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    880 to 920 mm
  • Max. Solder Height
    @ 10 µm: 420 µm, @ 15 µm: 385 µm
  • Lighting
    RGB LED
  • X-Y Axis Resolution
    0.5 µm
  • Z-Axis Resolution
    1 µm
  • Net Weight
    950 kg
  • Overall Dimensions
    1100 x 1570 x 1550 mm
  • Volume Repeatability
    < 1%

Technical Documents
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