TR7007QI

Solder Paste Inspection Equipment by Test Research, Inc (33 more products)
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Product Specifications

Product Details

  • Part Number
    TR7007QI
  • Manufacturer
    Test Research, Inc

General Parameters

  • Field of View
    4 MP - 20.3 x 20.3 mm, 30.5 x 30.5 mm, 12 MP -24.4 x 18.4 mm, 40.8 x 30.7 mm, 61.2 x 46.1 mm
  • Defects
    Insufficient Paste, Excessive Paste, Shape Deformity, Missing Paste, Bridge
  • Air‑Pressure Requirements
    5 to 6 bar
  • Measurement
    Paste Height, Paste Area, Paste Volume, Offset
  • PCB Size
    510 x 460 mm
  • PCB Thickness
    0.6 to 5 mm
  • PCB Weight
    3 kg
  • Imaging Method
    Stop-and-Go Imaging
  • Imaging Resolution
    6 μm, 10 μm , 15 µm (factory setting)
  • Imaging Speed
    4 MP - 3 FOV/sec, 12 MP - 2 FOV/sec, 12 MP CoaXPress - 3 FOV/sec
  • Height Resolution
    6 µm - 0.22 µm, 10/15 'µm - 0.4 µm
  • Camera
    4 MP, 12 MP (factory setting)
  • 3D Technology
    Shadow free
  • Top Clearance
    25 mm
  • Inspection Type
    3D
  • Bottom Clearance
    40 mm
  • Edge Clearance
    3 mm
  • Conveyor Height
    880 to 920 mm
  • Max. Solder Height
    @ 6 µm: 210/420 µm, @ 10/15 µm: 420/840 µm
  • Lighting
    RGB True Color LED
  • X-Y Axis Resolution
    0.5 µm with linear scale
  • Z-Axis Resolution
    0.5 µm with linear scale
  • Net Weight
    675 kg
  • Overall Dimensions
    1000 x 1500 x 1650 mm
  • Volume Repeatability
    < 1%

Technical Documents
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