SP3-C

The SP3-C from Hanwha Semitech is a high-precision solder paste printer that uses SQG Blade Tilting Technology for printing along both X and Y axes. It has an alignment repeatability of ±8 µm @ 6σ and wet print accuracy of ±15 µm @ 6σ ensuring exceptional precision for demanding PCB manufacturing processes. The printer offers a fast cycle time of 5 seconds (excluding printing) and supports PCB sizes up to L350 x W250 mm in single-lane or dual-lane (optional) configurations. Its stencil compatibility ranges from 550 x  650 mm to 736 x 736 mm, making it adaptable for varied production needs.

The SP3-C features an SPI Feedback System that automatically corrects print offsets using SPI inspection data, enhancing print quality. It has a 2D inspection system that detects and addresses defects like insufficient or excessive soldering, solder bridges, and foreign materials, preventing faulty prints. The printer’s solvent dipping cleaning technology further improves user convenience of the cleaner module and increases cleaning perance.