Edison II ACT

Edison II ACT

Solder Paste Printer by ITW EAE (5 more products)

Note: Your request will be directed to ITW EAE

The Edison II ACT from ITW EAE is a Solder Paste Printer that supports PCB dimensions from 50 x 50 mm to 450 x 350 mm. It has integrated automated changeover technology that is fast and consistent with reduced operator requirements, which results in error-free changeover and increased yield and throughput. This solder paste printer features a fully automated changeover of the stencil, tooling, and squeegees, which provides a fast and consistent changeover without opening the hood of the machine to access the inside. The automated paste cartridge and stencil changeover will benefit high-volume manufacturers, while automated support tooling and stencil changeover, as well as stencil and paste cartridge changeover, will benefit high-mix manufacturers. This high-accuracy printer has ±8-micron alignment and ±15-micron wet print repeatability (≥2 Cpk @ 6 sigma) and delivers 15 seconds of total cycle time with parallel processing capability.

The Edison II ACT base machine includes a paste drip tray that extends under the squeegees to prevent paste dripping while traveling over open apertures or across tooling. The tray is removable for cleaning and also features a quick load, self-sealing paste dispenser for accommodating the automated paste cartridge changeover. It includes an ultra-fast, high-efficiency wiping system with an extra-large (65m) paper roll which will typically last multiple shifts. Patented paper tension control provides more effective wiping, and a separate wiping and printing zone prevents cross-contamination. Built-in scanners and OpenApps provide data acquisition and connectivity for traceability of processes or sophisticated monitoring and control of production lines.

The Edison II ACT is optimized for ultra-fine pitch printing with paste transfer efficiency that exceeds requirements for the smallest apertures. It also has the ability to have three boards in the machine simultaneously which results in reduced transfer times and improved cycle time. This printer uses an EdgeLoc system with a side snugging technique that removes the need for top clamps, which interfere with the PCB-to-stencil contact. It uses high-resolution cameras with a field-of-view (FOV) of 9 x 6 m and the ultra-slim camera reduces the Z travel distance for optimal alignment accuracy.

In addition to automated changeover technology that is available in progressive stages, Edison II ACT also provides a scalable set of software, controls, and technology enhancements to suit the performance requirements of Semiconductor, Automotive, and Smart Device manufacturing markets. It uses Intueri GUI for a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with OpenApps 4.0, which provides a customizable portal to Industry 4.0 connectivity. This printer is available in an enclosure that measures 1440 x 12180 x 1589 mm and requires an AC supply.

Product Specifications

Product Details

  • Part Number
    Edison II ACT
  • Manufacturer
  • Description
    Fully-Automated Solder Paste Printer for PCB Sizes up to 450 x 350 mm

General Parameters

  • Type
  • Max board size
    450 x 350 mm
  • Frame Size
    737 x 737 mm, 584.2 x 584.2 mm
  • Print Speed
    305 mm/sec
  • Printing Accuracy
    15 µm
  • Printing Area
    450 x 350 mm
  • Repeat Accuracy
    15 µm
  • Substrate Thickness
    0.1 to 6 mm
  • Cycle Time
    15 sec, 20 sec
  • Air Pressure
    6.2 bar
  • Vision system
  • Power Supply
    200 to 240 VAC, Single Phase, 50/60 Hz, 15 A
  • Net Weight
    995 kg
  • Machine Dimension
    1589 x 1280 x 1440 mm

Technical Documents

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