The ALPHA CVP-390V from MacDermid Alpha Electronics Solutions is lead-free, no-clean Solder Paste designed to maximize flexibility in manufacturing. It provides excellent electrochemical reliability in harsh operating conditions and delivers consistent print and reflow performance across a wide range of component types. This solder paste has a wide process window and exhibits more than 2.0 Cpk transfer efficiency between 60 to 120% at area ratios above 0.60 for maximum process flexibility. It offers good solderability down to 170μm apertures on high density assemblies using both ramp and soak profiles. The ALPHA CVP-390V maintains repeatable transfer efficiency on fine feature 01005 components and excellent coalescence down to 170μm circle and square apertures.