Fine-Line Circuits Ltd

(0 reviews)
  • Type: Manufacturer
  • India, Maharashtra, Mumbai
  • 91-22-28290244/45
  • 145, SDF-V, SEEPZ-SEZ Andheri(E), Mumbai - 400096. India
Fine-Line-Circuits Limited - A Space accredited (ISRO- Space Application Qualified) publicly traded company located at Mumbai, India with a sales office in San Jose, USA manufacturing & exporting   world class quality of Printed Circuit Boards (PCBs) in small volumes & delivered rapidly for high reliability applications. We specialize in the production (including Duroids Series) of Space Grade RF Microwaves/High Frequency PCBs using a variety of Low Loss/High Performance laminates especially from Rogers, Nelco, Taconic & Panasonic substrates with Electrolytic Bondable Gold finish with full integrity of the RF path. We are the only approved PCB Supplier for India’s foremost Space Agency - ISRO (Indian Space Research Organization) for their RT Duroid PCBs which go into their Satellite Communicati...show more

PCB Fabrication Capabilities

Layers

Up to 24 Layers

Board Thickness

0.5 mm

Timeline

4-6 days for prototypes and 1 week for production

PCB Configuration

PCB Type

Material

Material Brand

Manufacture Type

PCB Assembly Capabilities

Board Type

  • Flexible
  • Rigid
  • Hybrid
  • HDI
  • Rigid-Flex

PCB Sides

  • Single Sided

Assembly Type

  • Mixed
  • Surface Mount
  • Thru Hole

Testing

  • Automated Optical Inspection (AOI)
  • X-Ray Inspection
  • Visual Inspection
  • In-Circuit Testing (ICT)
  • Functional Testing
  • Backplane Testing
  • Burn In Testing
  • Component Inspection
  • Component Value Check
  • DFT (Design for Testability)
  • ERSA Scope
  • Flying Probe Testing
  • Grid Testing
  • High voltage Testing
  • Hi-pot Testing
  • IC Burning
  • Impedance Testing
  • Soak Testing
  • Solder Paste Inspection
  • Thermal Aging Testing

Soldering Type

  • Hand Soldering
  • Leaded Solder
  • Lead-Free (RoHS)
  • Wave Soldering
  • Reflow Soldering
  • Robotic Soldering
  • Selective Soldering
  • Tin-lead Solder

Package Type

  • BGA
  • BGS
  • BTC
  • CBGA
  • CCGA
  • CCM
  • CGA
  • CLCC
  • COB
  • COF
  • CSP
  • CSPs
  • DFA
  • DFN
  • DIP
  • DSBGA
  • DSP
  • FFPGA
  • Flip Chip
  • Flip Chip SOIC
  • Flip-Chip
  • FPGA
  • GSP
  • IC
  • LCC
  • LCCs
  • LGA
  • LIDS
  • MBEA
  • MBGA
  • MCM
  • MELF
  • MEM
  • Micro-BGA
  • Mictor Connectors
  • MLF
  • MLP
  • MSOPS
  • Odd Form
  • PBGA
  • PLCC
  • POP
  • PQFN
  • QCG
  • QEP
  • QFN
  • QFP
  • QPF
  • QPN
  • SOD
  • SOIC
  • SOJ
  • SON
  • SOP
  • SOT
  • SSOP
  • TBGA
  • TQFP
  • TSOP
  • TSSOP
  • VFBGA
  • VGA
  • WLCSP
  • XFP

File Format

  • Ascii CAD
  • CAD
  • Centroid
  • DXF
  • Gerber
  • ODB ++
  • Orcad
  • Pulsonix

Order Type

  • Prototypes
  • Production

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