Fine-Line Circuits Ltd

Fine-Line-Circuits Limited - A Space accredited (ISRO- Space Application Qualified) publicly traded company located at Mumbai, India with a sales office in San Jose, USA manufacturing & exporting   world class quality of Printed Circuit Boards (PCBs) in small volumes & delivered rapidly for high reliability applications.

We specialize in the production (including Duroids Series) of Space Grade RF Microwaves/High Frequency PCBs using a variety of Low Loss/High Performance laminates especially from Rogers, Nelco, Taconic & Panasonic substrates with Electrolytic Bondable Gold finish with full integrity of the RF path.

We are the only approved PCB Supplier for India’s foremost Space Agency - ISRO (Indian Space Research Organization) for their RT Duroid PCBs which go into their Satellite Communication Systems.

Our capability to build RF Microwave PCBs is also with a special surface finish - Electrolytic Bondable Gold Direct on Copper and the gold thickness is of 1 to 4 microns and without Nickel ensuring the lowest signal losses and highest signal performance as the skin depth is optimized and as Nickel is absent there are no signal losses and further it also gives excellent gold wire bondability. These pcbs go into all High End Applications where Signal performance and reliability are key (like Onboard Satellite Communication Systems.)

Our Core Capability:

Products:-

High Frequency & Microwave PCB:

These are PCBs using various Rogers materials including RT / Duroid and also having special surface finish Electrolytic Direct Gold on Copper (Gold thickness of 2 micron to 4 micron) for Satellite Communication Systems.

Benefits:-

• Time and cost savings through reduced design and work preparation workload       
• Yield optimization on both sides
• Clear and unambiguous communication
• Stable transition from prototype to series production

High Copper Board PCB:

The typical high copper thickness achievable is at 210 microns. Upon request & with very special process & material we can go upto 350 micron with varying copper thickness for each layer.

Benefits:-

• Increased endurance to thermal strains.
• Increased current carrying capacity.
• Increased mechanical strength at connector sites and in PTH holes.

Multi-Layer PCB:

Complex High-count Multi-Layer Boards with fine pitch SMDs on both sides. 

Benefits:-

• Higher assembly density 
• Smaller size (considerable savings on space)
• Increased flexibility
• Easier incorporation controlled impedance features.

Impedance Controlled PCBs:-

Impedance controlled multilayer boards for high frequency and high speed applications.

Backplane & Oversized PCBs :- 

This type of special purpose board requires very dense package of plated through holes which are structurally strong and ductile to guarantee high speed and stable electronic signal flow.