PICA Manufacturing Solutions

SMT, Solder Paste Dispensing, Reflow, SMT Pick and Place, Conformal Coating, Automated Optical Inspection, X-Ray Inspection, Environmental Chamber, In-Circuit Test, X-Section Lab, 3.5x-180x Trinocular Microscope, Functional Test, Cable and Wire Harness, Turnkey Electronic Box Builds, Membrane Switch, Potting/Encapsulation, 3D Printing.

PICA Manufacturing provides turnkey solutions that streamline the entire product lifecycle—from design and material sourcing to assembly, testing, and delivery. As a single-source partner, the company manages every step, eliminating the need for clients to juggle multiple vendors or processes.

PICA’s integrated approach ensures consistent quality, reduced lead times, and simplified project management. Whether the requirement is for complex PCB assemblies or complete product builds, PICA assumes full responsibility for materials, manufacturing, and quality control.

With PICA Manufacturing as a partner, clients can focus on their core business while the company brings their ideas to market—faster, smarter, and more reliably.

Design & Engine Capabilities

PICA Layout Design Advantage

• Application Engineer Assigned to Each Design Project 
• 24/7 Application Engineering & Design Support 
• PCB Designs for Consumer, Medical, Industrial, Safety & Security, and Wearable Market Applications 
• Manufacturability Built into Each Design (DFM)
• Documentation Package Creation (Including Fabrication & Assembly)

Design Experience

• Impedance Control Modeling for Signal Integrity
• High-Frequency Signals
• R-Flex Designs
• HDI Designs
• BGA & Micro-BGA Layouts
• EMI Shielding Using Advanced Materials
• Thermal Management Using Metal Core or Metallized Substrates
• Etched Foil Heater Flex Design

PICA Manufacturing offers comprehensive box build assembly services that go beyond PCB assembly to deliver fully integrated, ready-to-deploy systems. From enclosures and wiring to displays, connectors, and power supplies, the company manages every component required to transform parts into complete, functional units.

With expertise in both hardware integration and software installation, PICA ensures that each product is thoroughly tested, configured, and production-ready. By partnering with PICA, clients eliminate the complexity of coordinating multiple vendors.

Whether for medical devices, industrial systems, or high-tech electronics, PICA’s box build solutions deliver quality, reliability, and speed—all under one roof.

Solder Paste Dispensing Method and Specifications 

Selective Solder Paste 

• Jetting Smallest solder dot & pad size — Min dot diameter = 250µm, 
• Pad size (min) = 250µm 
• Jet printing frequency — 1,080,000 dph (high-speed option) 
• Single dot accuracy — 40µm 
• Position resolution — 0.2µm 
• Maximum board size — 508 x 508mm (20" x 20") 
• Minimum board size — 70 x 40mm (2.7" x 1.6") 
• Board thickness range — 0.4 - 6.0mm (0.016" - 0.24") 
• Maximum board weight — 5kg (11lbs)

Stencil Printer

• Stencil size (mm) —  340*470 - 737*737
• Print position accuracy —  ±25µm
• Printing size (mm) —  50*50 - 510*508.5
• Stencil thickness (mm) —  0.05 - 5mm
• Warpage —  < Diagonal 1%
• Minimum printing component size (mm) —  01005 & 0.3mm PITCH (IC)
• Applicable Product —  PCB, FPC, & R-Flex