AIM Solder to Showcase Type 5 Solder Paste and Other Soldering Materials at SMTA Ohio Valley Expo

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AIM Solder has announced its participation in the upcoming SMTA Ohio Valley Expo & Tech Forum. This event takes place on August 21 at Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio. As a leading global manufacturer of solder assembly materials for the electronics industry, AIM will be showcasing cutting-edge soldering materials. These include Type 5 solder paste offerings as well as finer solder paste solutions.

In celebration of emerging trends in electronics miniaturization, AIM has declared 2025 the “Year of Type 5”. AIM’s decades of experience producing high-quality solder pastes make the company uniquely positioned to guide customers through the transition to finer powders.  In addition, AIM develops products with a focus on consistency, reliability, and process optimization coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating. Learn how demand for precise and consistent soldering is driving this trend.

AIM’s Gayle Towell will also be giving a technical presentation at 9:00 AM titled, “When to Downsize: Process Considerations and Market Drivers for Transitioning to Type 5 Solder Paste.” This presentation will provide practical guidance on evaluating when downsizing is beneficial, addressing key considerations such as stencil design, printability, defect prevention, and more. It will explore borderline cases where switching may not be straightforward, offering data-driven insights and best practices to ensure an optimized soldering process.

Click here to learn more about the SMTA Ohio Valley Expo & Tech Forum.