AIM Solder to Spotlight Type 5 Solder Paste at SMTA Upper Midwest Expo 2025

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AIM Solder has announced its participation in the SMTA Upper Midwest Expo & Tech Forum. This event takes place on June 25th at the DoubleTree Minneapolis–Park Place in Minneapolis, MN. As a leading global manufacturer of solder assembly materials for the electronics industry, AIM will be showcasing cutting-edge soldering materials. These include Type 5 solder paste offerings as well as finer solder paste solutions.

In celebration of emerging trends in electronics miniaturization, AIM has declared 2025 the “Year of Type 5”. AIM’s decades of experience producing high-quality solder pastes make the company uniquely positioned to guide customers through the transition to finer powders. In addition, AIM develops products with a focus on consistency, reliability, and process optimization coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating. Learn how demand for precise and consistent soldering is driving this trend.

SMTA Upper Midwest Expo & Tech Forum is a local SMTA expo that provides a great platform to bring professionals within the industry together and provide attendees with exposure to global technology at a local level. In addition, this local expo provides an opportunity to educate local engineers who may not be able to attend SMTA International.

Click here to learn more about the SMTA Upper Midwest Expo & Tech Forum.