AIM to Showcase its Latest Soldering Innovations at FIEE Expo 2025 in Brazil

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AIM Solder has announced its participation in the upcoming FIEE Expo. This event takes place September 9-12 at the Sao Paulo Expo in Brazil. As a leading global manufacturer of solder assembly materials for the electronics industry, AIM will be showcasing cutting-edge soldering materials. These include M8 solder paste, Type 5 and finer solder paste offerings, and other soldering solutions.

AIM engineered M8 No Clean Solder Paste for the most demanding applications, including automotive, LED lighting and EMS assemblies. M8 solder paste provides consistent transfer efficiency at area ratios >0.50 while eliminating head-in-pillow (HiP) and non-wet-open (NWO) defects. It also reduces voiding to <5% on BGA components and <10% on BTC components.

In celebration of emerging trends in electronics miniaturization, AIM has also declared 2025 the “Year of Type 5”. AIM’s decades of experience producing high-quality solder pastes make the company uniquely positioned to guide customers through the transition to finer powders.  In addition, AIM develops products with a focus on consistency, reliability, and process optimization coupled with robust technical support. While Type 5 solder paste won’t replace Type 4 as the industry standard this year, its adoption is accelerating. Learn how demand for precise and consistent soldering is driving this trend.

Click here to learn more about AIM Solder.