BGA Technology Adds Creative Electron's X-ray Inspection System for Non-Destructive Inspection Applications

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BGA Technology, a provider of advanced electronics testing and inspection services, has expanded its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility. The X-ray system enables BGA Technology to perform non-destructive inspection of electronic assemblies, including BGAs, QFNs, and hidden solder joints used in high-reliability applications. The system supports the detection of defects, including voiding, insufficient solder, and misalignment, that are not visible through traditional inspection methods.

Product

TruView Simplex

“We continue to invest in the tools and technology needed to support our customers at the highest level,” said Jayanth Kygonhalli, CTO, BGA Technology. “The addition of this Creative Electron system allows us to deliver faster, more accurate analysis and further reinforces our commitment to quality and reliability.”

The TruView™ Simplex system provides imaging and analysis capabilities used for failure analysis, process validation, and quality assurance requirements across multiple industries. BGA Technology stated that demand for inspection technologies is increasing in sectors including aerospace and defense, where electronics require process control, traceability, and inspection of hidden solder connections.

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