Dymax Granted Patent for its Adhesive Bonding Technology that Improves Curing Performance

Dymax Granted Patent for its Adhesive Bonding Technology that Improves Curing Performance712370

Dymax, a manufacturer of rapid curing materials and equipment, has been granted a patent for its HLC™ (Hybrid Light-Curable) adhesive platform. The new technology combines the optimal qualities of anionic polymerization and free radical chemistries into one formulation.

The newly patented HLC™ technology aims to improve the curing performance of urethane (meth)acrylate compositions commonly used to formulate coatings, adhesives, sealants, and inks. Primary advantages of HLC™ include fast cure, low-to-no blooming after proper light cure, better aesthetics, moisture resistance, and more flexible joints than ordinary cyanoacrylates.

While standard light-curing materials cure effectively using UV/Visible light, they often struggle in areas where the light cannot reach, leaving behind uncured areas. These shadowed regions not only compromise the reliability of the final product but can also weaken adhesive bonds over time. HLC addresses the issue of incomplete curing in dark areas with rapid moisture/contact cure capability. Bonding to a broad range of substrates, including opaque and light-blocking materials, is also possible.

Due to the composition of their light-curing component, Dymax HLC adhesives form a cross-linked polymer framework, enabling the successful bonding of small gaps or larger joints. Light-curing also reduces the risk of "blooming," a common issue with cyanoacrylates, where a white residue forms at the edges of bond lines when they react with ambient humidity. Light-curing can significantly reduce the risk of blooming as the material cross-links before the monomer can volatile.

Dymax HLC-M-1000, the first adhesive in the series, is engineered for medical applications and meets several biocompatibility standards. Its light-curing capabilities allow for rapid curing in seconds with low-intensity light, optimizing performance even at ~20 mW/cm². With an extremely low viscosity of 3 cP, the material is capable of wicking into extremely tight bond joints not typically accessible with other, higher-viscosity adhesives.

"HLC™ technology fills a gap that many manufacturers using light-curing technology face when bonding opaque substrates," said Dr. Ahmet Nebioglu, Dymax Sr. R&D Director, Global. "It balances the need for rapid cure in light or darkness while addressing the issues of blooming, low impact resistance, and limited long-term moisture exposure. This new technology is a breakthrough for adhesion quality in the manufacturing process."

This advancement may provide greater product reliability for end users through improved curing, stronger bonds, and enhanced durability, contributing to the overall quality of finished components.

For technical inquiries about patented HLC technology, a team of Dymax application engineers and system integrators is available to develop customized dispensing solutions for users, assist with material handling challenges, and support customers throughout the manufacturing process. 

Patent granted for Dymax's novel hybrid HLC adhesive series

The innovative adhesive solution offers numerous advantages when bonding a wide variety of substrates, including opaque ones

Dymax, one of the manufacturers of light-curing materials and devices, has been granted the patent for its innovative HLC™ (Hybrid Light-Curable) platform. The innovative product family combines the best properties of purely chemical anionic polymerization with radical crosslinking in one formulation. This means that even opaque and even opaque substrates can be bonded quickly, reliably, and safely.

The newly patented HLC technology aims to improve the curing performance of urethane (meth)acrylate compositions commonly used to formulate adhesives, coatings, sealants, and inks. The key benefits of HLC™ include fast cure, little to no blooming after appropriate light curing, better aesthetics and moisture resistance, and more flexible bonds than conventional cyanoacrylates (CAs).

While light-curable materials cure effectively with UV/LED light, they have limitations in areas that the light cannot reach. These shadow zones not only affect the reliability of the final product but can also weaken adhesive bonds over time. HLC materials solve the problem of incomplete cures in opaque and opaque areas by providing rapid moisture/contact cures. This also enables adhesion to a wide range of substrates, including light-blocking materials.

Due to the composition of their light-curing component, Dymax HLC adhesives form a cross-linked polymer framework that enables successful bonding of not only small gaps but also larger joints and even smaller areas. Light-curing also reduces the risk of "blooming" - a common problem with cyanoacrylates where a white residue forms at the edges of the bond lines when they react with ambient moisture. Light-curing can significantly reduce the risk of blooming because the material cross-links before the monomer can evaporate.

Dymax HLC-M-1000, the first adhesive in the series, is designed for medical applications and meets several biocompatibility standards. Thanks to its light-curing properties, it can cure in seconds at very low light intensity (~ 20mW/cm²). With an extremely low viscosity of 3cP, the material is able to flow into extremely tight joints that are normally inaccessible with other, higher-viscosity adhesives.

"HLC™ technology fills a gap faced by many manufacturers using light-curing technology when it comes to bonding opaque substrates," said Dr. Ahmet Nebioglu, Dymax Senior Director of R&D Global. "It strikes a balance between rapid curing in light or shadow areas and overcomes the problems of blooming low impact strength, and limited long-term moisture resistance. This new technology represents a significant breakthrough in the quality of adhesive bonds in the manufacturing process."

This advancement provides end users with greater product reliability through improved curing, stronger bonds, and increased durability, thus contributing to the overall quality of the finished components.

For technical inquiries regarding the patented HLC technology, a team of Dymax application engineers and system integrators are available to develop customized dispensing solutions for users, assist with material handling challenges, and accompany customers throughout their entire manufacturing process.

Click here to learn more about HLC™ (Hybrid Light-Curable).

Publisher: PCB Directory
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