Electroninks Enters Strategic Distribution Agreement with Insulectro to Expand Reach in North America

Electroninks Enters Strategic Distribution Agreement with Insulectro to Expand Reach in North America712370

Electroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, has entered into a strategic collaboration and distribution agreement with Insulectro, a premier distributor of materials for printed electronics and advanced interconnect manufacturing. This alliance strengthens Electroninks’ footprint in North America and enhances customer access to its MOD inks across industries, including aerospace, defense, automotive, and high-tech manufacturing.

Electroninks has commercialized gold, silver, and platinum-based inks optimized for inkjet, screen, and aerosol jet printing. These materials are widely adopted in OEM design, commercial product development, and government research, reflecting the growing demand for high-performance, additive-ready metallization solutions. The partnership with Insulectro leverages its strong customer engagement, technical expertise, and proven ability to support early-stage design and OEM pathfinding programs, including Department of Defense initiatives.

At Electroninks, we value this relationship with Insulectro, which is a trusted, respected, and highly knowledgeable name with our customers and market. This relationship supports our advanced metallization products and overall critical materials supply chain initiatives with our customers here in North America,” said Melbs LeMieux, president and co-founder at Electroninks.

Insulectro, the largest distributor of printed circuit boards and printed electronics materials in North America, will now offer Electroninks’ advanced inks within its portfolio of best-in-class solutions.

Patrick Redfern, Insulectro president and chief executive officer, commented, “I can’t wait for the people building UHDI to see what this stuff can do. MOD is magic and has the potential to replace the costly electroless process. This is a strategic move to support the companies in North America that are investing in additive and chip packaging technologies. America needs these companies to be successful!”

With eleven stocking locations across the U.S. and Canada, Insulectro provides just-in-time delivery, supply chain reliability, and deep technical support to specialty manufacturing customers. Its long-standing relationships with leading military, aerospace, and automotive manufacturers position it to accelerate the adoption of new material technologies in high-performance applications.

The partnership also reduces supply chain risks by leveraging Insulectro’s robust domestic infrastructure, helping customers avoid tariff challenges and ensuring material availability for U.S.-based innovation programs.

This partnership is a natural fit,” Dhaval Patel, chief financial officer at Electroninks, added. “Insulectro’s extensive network and application engineering capabilities allow us to better support customers at the design and prototyping stages—accelerating time to market for next-generation devices.

Redfern concluded, “Insulectro’s portfolio of materials is defined by bedrock products that are proven high performers, and our customers count on every day. And, our pioneering spirit, that Insulectro was built on, is always scanning for emerging technologies that will enable our customers to expand their capabilities.

Click here to learn more about Electroninks.

Click here to learn more about Insulectro.

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