IEEE Electronic Components and Technology Conference 2025 Announces Call for Papers for its 75th Edition

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The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has announced a Call for Papers for ECTC 2025, the conference’s 75^th anniversary.

The 75^th annual ECTC will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas. More than 2,000 scientists, engineers, and business people from more than 20 countries are expected to attend. 

The ECTC 2025 technical program will address new developments, trends, and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer-level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies in electronics packaging.

ECTC has announced that abstract submission will open on August 26, and the deadline for submissions is October 7, 2024. Previously unpublished, non-commercial paper abstracts are requested in areas including:

• Applied Reliability
• Assembly and Manufacturing Technology
• Electrical Design and Analysis
• Emerging Technologies
• RF, High-Speed Components & Systems
• Interconnections
• Materials & Processing
• Thermal/Mechanical Simulation & Characterization
• Packaging Technologies
• Photonics
• Interactive Presentations

Click here for major topics and other important information on ECTC 2025's Call for Papers.