Indium Corporation Expert to Present sTIMs Research for AI Thermal Challenges at IEEE ECTC

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Indium Corporation Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal interface materials (sTIMs) to address next-generation AI and high-performance computing thermal challenges at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.

The presentation, Fluxless Vacuum Formic Acid Reflow of Indium Solder Thermal Interface Materials in Large Area BGA Packages, states that indium sTIMs, with 86W/mK thermal conductivity, outperform polymer thermal interface materials (TIMs) through metallurgical bond capability, and improved thermal cycling performance and reliability. Additionally, vacuum formic acid reflow minimizes voiding for multi-reflow applications like BGA assembly. Research results demonstrate pathways to low voiding for uniform heat dissipation in next-generation processors and data center applications.

Kyle Aserian is an Applications Development Engineer in the ESM department, specializing in high-performance TIMs and their implementation into assemblies. He joined Indium Corporation in 2022 as a Research Associate Scientist, focusing on solder alloy characterization and test method development.

ECTC attendees can attend Aserian’s presentation on May 27 at 11:55 a.m. EDT. To learn more about Indium Corporation’s solder thermal interface materials, meet with company representatives at ECTC booth 240.

Click here to learn more about the sTIMs.

Event

IEEE 76th Electronic Components and Technology Conference 2026