Kurtz Ersa to Showcase Advanced Soldering and Reflow Solutions at IPC APEX EXPO 2026

https://cdn.pcbdirectory.com/news/700_365_H_16__639057949636097600.webp712370

Kurtz Ersa Inc., a leading supplier of electronics production equipment, will exhibit at the 2026 IPC APEX EXPO, taking place March 17 to 19 at the Anaheim Convention Center in Anaheim, California. Visitors to Booth 2113 will be able to see the latest additions to Ersa’s portfolio of reflow, selective soldering, rework, and connected soldering solutions, many of which will be presented publicly for the first time.

On display will be the HOTFLOW THREE reflow oven in a 16-zone configuration, along with several new and updated selective soldering platforms, including the VERSAFLOW FIVE and VERSAFLOW 4 Core. Ersa will also demonstrate the HR 600 XL rework system featuring a newly introduced heating head, as well as the i-CON TRACE soldering station, now equipped with IPC CFX certification for connected factory environments.

A key highlight of Ersa’s presence at APEX EXPO is the VERSAFLOW FIVE selective soldering system, which introduces a new approach focused on higher output and reduced line complexity. Central to the system is the VERSAFLEX 2.0 solder module, which enables two printed circuit boards to be processed independently within a single machine.

This parallel processing capability increases throughput without requiring additional equipment or floor space. Features such as automatic solder nozzle changing and matrix-controlled preheating are designed to address setup, consistency, and repeatability challenges, particularly in high-mix, high-volume production environments.

Also featured at the booth, the HOTFLOW THREE reflow oven incorporates Ersa’s SCPU® (Smart Convection Power Unit), providing precise thermal control while significantly reducing nitrogen consumption. Designed for stable profiling and strong repeatability, the system supports modern connectivity requirements while helping manufacturers balance process performance and operating efficiency.

The HR 600 XL rework system will be shown with a new heating head developed for large-format and high-density assemblies. The system supports precise, controlled rework of BGAs, QFNs, connectors, and other complex components, using vision-assisted alignment and intelligent process control to ensure consistent results on densely populated and sensitive boards.

Ersa will also present the SRO i-LINE, a high-performance vacuum soldering system designed for series production in microelectronics and semiconductor manufacturing. The compact system supports up to three integrated process chambers, enabling high throughput without increasing floor space. Short cycle times, advanced vacuum soldering capability, and powerful infrared heating deliver excellent temperature uniformity and void-free solder joints. By evacuating the process chamber to below 1 mbar and backfilling with ultra-pure nitrogen, the system achieves oxygen levels below 3 ppm, while an integrated formic acid process supports optimal wetting and solder quality.

In addition, Ersa will showcase the Interflux ICSF Select6 stand-alone spray fluxer, which uses advanced drop-jet fluxing technology to provide fast and highly precise flux application. Designed for seamless integration with wave and selective soldering systems, the ICSF Select6 improves soldering performance by enhancing flux accuracy, reducing material waste, and supporting consistent solder joint quality.

For hand-soldering applications, Ersa will present the i-CON TRACE soldering station, the company’s first fully networked platform. With built-in traceability, IoT connectivity, and IPC CFX certification, i-CON TRACE delivers detailed insight into hand soldering processes while supporting quality assurance, documentation, and compliance requirements.

Click here to know more about the Kurtz Ersa product pipeline on PCB Directory.