Lucintel Estimates HDI PCB Market to Reach $20.8 Billion by 2030 at CAGR of 4.8%

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According to Lucintel's new report, the High-Density Interconnect (HDI) PCB Market is projected to reach an estimated $20.8 Billion by 2030 from $15.2 billion in 2023, at a CAGR of 4.8% from 2024 to 2030. Growth in this market is primarily driven by increasing demand for miniaturization of electronic devices and rising demand from 5G and IoT.

Browse 99 figures/charts and 76 tables in this 199-page report to understand trends, opportunities, and forecast in high-density interconnect (HDI) PCB market by end-use industry (smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive, and others), technology (4-6 layer, 8-10 layer, and 10+ layer), build-up structure (1+n+1, 2+n+2, 3+n+3, and others), and region (North America, Europe, APAC and the Rest of the World).

Lucintel forecasts that 4-6 layers will remain the largest segment due to increasing demand for smartphones and telecommunication equipment. The 10+ layer HDI PCB market is expected to witness the highest growth during the forecast period due to the growing demand for smart wearables and connected devices.

Smartphones will remain the largest end-use industry due to the increasing demand for high-performance PCBs and the growing demand for more smartphone space for larger batteries. Automotive is expected to witness the highest growth over the forecast period due to advancements in automotive electronics.

Asia Pacific will remain the largest market and is also expected to witness the highest growth over the forecast period due to the increasing electronic content in automotive and growth in consumer electronic devices and telecommunication products.

TTM Technologies, Inc., Tripod Technology Corporation, AT&S, Kingboard Holdings Ltd., CCTC, DG Shengyi Electronics, Dynamic Electronics Co. Ltd., Gold Circuit Electronics, Olympic, DAP, Unimicron Technology Corp., Compeq Manufacturing Co., Ltd., Ibiden Co., Ltd., Zhen Ding Technology Holding Limited, Unitech, Samsung Electro-Mechanics, and Meiko Electronics Co. Ltd. are the major supplier in the high-density interconnect (HDI) PCB market.

Click here to download the report on the HDI PCB Market.