https://cdn.pcbdirectory.com/news/March_25_27_2026_SNIEC_Shanghai_639092510808059151.webp712370
MacDermid Alpha Electronics Solutions, a supplier of specialty chemicals and materials used in electronics manufacturing and semiconductor packaging, will present its integrated materials platform at Productronica China 2026, taking place March 25–27 at the Shanghai New International Expo Center. The company will demonstrate materials strategies designed to address reliability, process stability, and sustainability across electric vehicles (EVs), automotive, consumer, and high-performance computing applications.
As electronics systems become more compact and thermally demanding, manufacturers are facing increasing requirements related to yield, product lifetime, and cost management while also addressing environmental considerations and supply chain changes. The company states that these challenges require materials designed to operate together across die attach, interconnect, thermal management, and protection processes.
“Reliability is never the result of a single material or process,” said Scott Lewin, Technical Business Development Director at MacDermid Alpha Electronics Solutions. “It comes from selecting a coordinated set of materials engineered to work together - solder pastes, alloys, reinforcements, and thermal protection - matched to the demands of the application. The more accurately we align materials to use conditions, the more effectively we reduce risk and optimize total cost of ownership.”
At the event, the company will present soldering, die attach, thermal management, and environmental protection technologies designed to operate as part of a coordinated materials platform. This approach can help manufacturers manage process variability, accelerate qualification, and reduce the risk of field failures.
In PCB assembly, the company will present materials such as the ALPHA® OM-100 solder paste, a silver-free solder paste designed for thermomechanical reliability while addressing material cost considerations. The company will also present ALPHA® OM-362 solder paste, which is designed to reduce voiding in ball grid arrays (BGAs) and bottom-terminated components.
The presentation will also include Electrolube thermal management and protection technologies, including liquid gap fillers and the 2K301P two-component conformal coating. These materials are used for heat dissipation and environmental protection in applications such as automotive systems, power electronics, and consumer electronics.
MacDermid Alpha Electronics Solutions continues to expand manufacturing and technical service capabilities in China as part of its regional operations. The company will be located in Hall E4, Booth 4700 at Productronica China 2026.
Click here to learn more about the MacDermid Alpha Electronics Solutions.
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