The Assembly Solutions Division of MacDermid Alpha Electronics Solutions will present low voiding solutions at the SMTA Juarez Expo & Tech Forum on Thursday, May 19.
Customer Technical Engineer, Francisco Gallegos, will present “Solder Void Causes and Industry Reduction Strategies” as part of the Technical Forum. Gallegos will focus on the most common causes of voids in solder joints, addressing the impact of different materials, design, equipment, and solder chemistry, and outlining the different strategies for preventing voids, including traditional solutions through stencil design and reflow profiles. The paper will also address other techniques for void mitigation, such as using solder preforms and vacuum reflow ovens.
MacDermid Alpha will also participate in the Expo, promoting both the Alpha and Kester portfolios for low voiding solutions which can increase reliability, enhance electrical and thermal performance, and eliminate costly rework.
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
Note:- You need to sign in/sign up to submit a request quote.
Note:- You need to sign in/sign up to submit a review.