NECTEC Launches a Complete Portfolio of Next-Generation SMT Solutions

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NECTEC, a leading provider of SMT electronics manufacturing equipment, has announced the launch of its next-generation SMT line solutions. The expanded portfolio includes the company’s newly upgraded pick-and-place machines, specialized LED assembly solutions, advanced reflow oven technology, high-precision X-ray inspection systems, high-speed X-ray counters, and a new range of soldering materials. With this comprehensive offering, NECTEC strengthens its position as a complete SMT line provider for global electronics manufacturers.

Next-Generation Pick-and-Place Technology

The new pick-and-place machine series covers desktop, high-speed, multifunctional, LED, DOB, LED lens, and odd-shape models. Designed for flexibility and ease of use, these systems feature intuitive software, minimal labor requirements, and highly configurable options. Key innovations include one-click feeder cart changes, QR/barcode recognition, and smart feeders with full traceability, ensuring compatibility with global SMT standards.

Specialized LED Pick-and-Place for Lighting

Addressing the growing demand for LED assembly, NECTEC has introduced upgraded LED pick-and-place machines optimized for lighting fixtures, DOB, and LED lens mounting. Supporting PCBs up to 1500 mm in length, these systems provide faster PCB transfer, precise thermal compensation, compact footprints, and stable alignment technology—delivering reliable assembly and improved throughput for large-scale LED lighting production.

Advanced X-ray Inspection and Counting Systems

NECTEC's  latest pick-and-place machines handle components from tiny 0201 packages to large ICs and BGAs up to 40 × 40 mm with exceptional precision. To support advanced PCB manufacturing and quality verification, the company has also launched enhanced X-ray inspection systems featuring 3D CT, HDR imaging, and automated defect detection. These solutions address a wide range of applications, including PCBs, BGAs, automotive electronics, and semiconductor devices.

Complementing inspection, the upgraded X-ray counter offers fast and accurate component counting, achieving 99.9% accuracy in just seven seconds. It supports reels from 7 to 17 inches and components as small as 01005, while integrating seamlessly with ERP/MES/WMS systems through improved barcode scanning—helping manufacturers reduce labor costs and improve productivity in component management.

Energy-Efficient Reflow Ovens and Soldering Materials

To ensure defect-free soldering after placement, NECTEC has launched its latest lead-free reflow oven series, available in 6, 8, 10, and 12 heating zone models. These ovens deliver precise thermal control across varied PCB types, improving soldering reliability while optimizing energy efficiency.

In addition, NECTEC has expanded its soldering materials portfolio to include solder paste, solder wire, solder bars, fluxes, and conformal coatings. Developed in collaboration with Japanese partners, these materials are engineered to meet the demands of precision electronics manufacturing.

“With this launch, NECTEC offers customers a complete portfolio of next-generation SMT solutions,” said James Wong, CEO of NECTEC. “From pick-and-place machines to reflow ovens, X-ray systems, and soldering materials, our mission is to provide electronics manufacturers with the tools to achieve higher productivity, improved quality, and lower operating costs.”

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