OKI Circuit Technology Manufacturers 124-Layer PCBs for AI-Based GPU and Memory Semiconductor Applications

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OKI Circuit Technology produces 124-layer PCBs for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM, mounted on AI semiconductors. This is a roughly 15% increase in the number of layers over conventional 108-layer designs.

AI processing requires the transmission of vast data volumes between graphics processing unit (GPU) semiconductors and memory. As semiconductor performance increases, the memory installed is also required to have high-speed, high-frequency, and high-density data transfer capabilities. HBM features a stacked DRAM structure, requiring technology capable of fabricating wafers even more thinly and precisely. This configuration also requires that the PCBs used in inspection equipment meet even higher levels of performance and quality.

Since the latest semiconductors process an enormous number of signals, and the number of wafer-mounted chips increases due to process miniaturization, it is necessary to increase the density and add more layers on the PCBs used in inspection equipment. Nevertheless, PCB thickness has been limited to 7.6 mm due to various constraints, and 108 layers was the maximum limit with conventional technology. OTC has successfully developed 124-layer PCB technology with a board thickness of 7.6 mm by developing ultra-thin materials and tools and handling technologies suitable for ultra-thin materials, together with developing and introducing a proprietary automatic transport system for ultra-thin materials into its production line.

OKI is actively engaged in its EMS business based on the core idea of providing comprehensive manufacturing services from design to production and reliability testing. OKI places a particular focus on technology development in the PCB business, and this new technology was developed in response specifically to the areas expected to show future growth, including AI semiconductors, aerospace, defense, robotics, and next-generation communications.

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