Stannol Unveils New Sustainable Low-Temperature Solder Paste for Sensitive Electronics

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Stannol presents the new no-clean low-temperature solder paste SP6000 TBS04, which has been specially developed for applications with reduced peak temperatures in the reflow process, such as in LED technology or optoelectronics. The solder paste is based on the alloy Bi57.6Sn42Ag0.4 and combines technical performance and sustainability.

Product features at a glance

• Low melting range (~140 °C): ideal for temperature-sensitive components with a maximum reflow temperature of just 170-180 °C
• Solder powder made from recycled material: around 85% CO2 savings
• Reduced system wear and energy consumption thanks to lower process temperatures
• High long-term reliability thanks to 0.4% silver content, more durable than pure BiSn alloys
• Suitable for fine-pitch applications up to 0.4 mm and miniature components
• Good press-on behaviour even after longer printing breaks
• Flexible use in reflow processes under air or nitrogen
• Very good wetting properties on common surfaces
• RoHS-compliant

Click here to learn more about the SP600 TBSO4 solder paste from Stannol.