Test Research, Inc. (TRI) proudly presents the TR7600 SV Series. The 3D AXI breakthrough outperforms its predecessor, the award-winning TR7600 Series, by a staggering 20% increase in performance.
With a remarkable 7 µm resolution, the TR7600 SV guarantees high resolution and high-yield-rate inspection. TRI's AXI is equipped with AI algorithms, which are superior to the commonly used gray-level-based algorithms. The AI algorithm can accurately detect void defects.
Industries ranging from automotive electronics to telecommunications and high-throughput production sectors will benefit from the TR7600 SV Series' fast image reconstruction and defect detection capabilities. Unlike competitors, TRI's X-ray inspection solutions secure the sample on the conveyor while inspecting it, preventing further damage. The system offers adjustable imaging parameters for tailored inspections and inline fine-tuning capabilities.
The TR7600 SV supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).
Click here for more information about the TR7600 SV Series.
Publisher: PCB Directory