Ventec to Showcase Advanced Materials Portfolio at Productronica 2025

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Ventec International Group will present its advanced materials at Productronica 2025 in Munich, running from November 18 to 21. The company will highlight materials from its "Glass Free Revolution," including new pre-preg and thermal-bond bondply, including high-performance RCF and RCC designed to support very high multi-GHz signal speeds.

In stack-ups for cutting-edge applications like AI data centers and 5G infrastructure, and chip testing applications, traditional glass reinforcement introduces tiny variations in dielectric properties that can degrade signal integrity at elevated frequencies. Ventec’s new glass-free pro-bond thermal-bond formulas, with Dk from 2.8 to 3.05 and Df from 0.0007 to 0.0065, ensure stable characteristics in high-frequency designs and boards with ultra-fine features. Visitors to Productronica can discover how IC substrates and interposers, HDI boards, motherboards, server backplanes, and cellular network power amplifiers can reach new levels of performance using these materials.

Ventec will also feature curated portfolios for high-reliability sectors. The 'autolam' selection is chosen to help automotive electronic designers find the right materials, focusing on thermal management, high-temperature performance, corrosion and CAF resistance, and high-speed signal integrity. For aerospace projects, Ventec’s 'aerolam' portfolio provides AS9100-accredited materials selected for high-temperature performance, stability, and reliability.

Further highlights include Ventec’s tec-thermal thermally conductive laminate and pre-preg & IMS material technology for applications such as power conversion, electrical drives, and lighting. The showcase will also feature the 'tec-speed' range of halogen-free low-loss materials and the ultra-low-loss tec-speed 30.0 PTFE-based material, which has a Df as low as 0.0009 for high-speed digital, radar, and RF applications.

At the booth, the ThinFlex series of adhesive-less and halogen-free flexible copper-clad laminates will be available for optimised flex-rigid PCB stack-ups. The booth will also feature precision drills from Jinzhou, now available through Ventec in EMEA, in sizes down to sub-mm diameter for drilling and slotting PCBs and package substrates. Additionally, Ventec Giga Solutions will display its PCB manufacturing consumables and materials, including the high-performing Yeitek contact cleaning machine.