YINCAE Advanced Materials announced that their company was awarded the 2022 Global Technology Award in the Adhesives, Underfills, and Encapsulants category. This ceremony took place on Wednesday, November 2nd at SMTAI 2022 Exhibition in Minneapolis, USA.
YINCAE’s die attach material was recognized as one of the products that made the greatest impact on the electronics industry in the years 2021 and 2022. Due to its unique properties, the YINCAE die attach adhesive has a high thermal conductivity and can achieve very thin bonding line thickness- there is no bleeding and migration issue. It has excellent bonding strength, a thermal cycling performance, and can withstand extreme temperatures (-273°C) without any delamination.
About Global Technology Awards
The Global Technology Awards are universally recognized as the most international industry award, attracting entries from Europe, the USA, and Asia. Each year the Global Technology Awards recognize the latest innovations in production equipment and materials for the EMS industry through a distinguished panel of industry experts.
Click here to learn more about YINCAE Advanced Materials.
Publisher: PCB Directory