YINCAE to Showcase Advanced PCB Assembly Materials at SEMICON Southeast Asia 2025

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YINCAE Advanced Materials, a leading provider of innovative solutions for the semiconductor and microelectronics industries, has announced its participation in SEMICON Southeast Asia 2025. This premier event for the semiconductor and microelectronics sector will take place from May 20-22, 2025, at the Sands Expo and Convention Center in Singapore. YINCAE will be showcasing its latest advancements at booth #B2939.

Attendees are invited to visit YINCAE’s booth to explore the company’s cutting-edge innovations in board-level assembly materials, underfill, die attach adhesives, wafer-level materials, optoelectronic materials, and thermal interface materials. YINCAE’s team of experts will be available to discuss how its solutions address the evolving needs of the semiconductor and microelectronics market, with applications spanning automotive, military, aerospace, consumer electronics, telecommunications (e.g., 5G/6G), and AI.

“SEMICON Southeast Asia is a pivotal event for connecting with key stakeholders in the region’s semiconductor ecosystem,” said YINCAE’s CEO. “We are excited to showcase our latest innovations and collaborate with customers to develop solutions that drive the semiconductor industry forward.”

Click here to learn more about YINCAE.

Click here to see SEMICON Southeast Asia 2025 event coverage on PCB directory.