YINCAE to Showcase High-Performance Materials at IMAPS 2025 in San Diego

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YINCAE, a global leader in advanced electronic materials, is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at the 2025 IMAPS, San Diego, September 30 to October 1. Visitors will experience next-generation solutions designed to meet the reliability, thermal, and processing challenges of today’s most demanding electronic applications.

Key Highlights to be Showcased at IMAPS 2025

• High-Performance Underfill (UF 120HA2):
  1. 100% compatible with no-clean flux residue
  2. Passes 10×260°C reflow without cleaning
  3. Low CTE for superior reliability
  4. Fast flow and rapid cure for efficient assembly
• Advanced Die Attach Materials (TM 230-2):
  1. Low-void, high-reliability solutions
  2. Low-temperature process compatibility
  3. Options for both soldering and sintering for large-die applications
• Next-Generation Liquid Metal Solutions ( TM 150LM):
  1. High viscosity and superior reliability
  2. No blow-out or pump-out, even under thermal cycling
  3. Exceptional heat dissipation for TIM1, TIM1.5, and TIM2 applications

“Our portfolio demonstrates a unique combination of thermal performance, reliability, and process efficiency,” said Dr. Wusheng Yin, CEO at YINCAE. “We’re excited to showcase materials that enable the future of advanced packaging and high-power devices.”

Join YINCAE at Booth #817 at the IMAPS Symposium 2025 in San Diego, CA (Sept. 30 – Oct. 1) for a live demo and to meet the team.

Click here to learn more about IMAPS 2025.

Click here to learn more about YINCAE.