Latest PCB (Printed Circuit Board) News | IDTechEx

With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly us... Read More

IDTechEx has unveiled the report titled "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets", which analyzes the technologies and market trends that promise to bring electronics manufacturing into the 3D realm. Drawing from over 30 company profiles, the repor... Read More

IDTechEx has released a report titled "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications."  Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as sma... Read More

IDTechEx Research, a trusted provider of independent market intelligence, announces the availability of a new report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets". This IDTechEx report assesses the competing technologies that will enable PCBs to be re... Read More

IDTechEx has released a new report titled, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", which thoroughly explores the latest innovations in semiconductor packaging technology, covering key technical trends, analyzing the value chain, evaluating major... Read More

IDTechEx has released their report "Advanced Semiconductor Packaging 2023-2033" and "Materials and Processing for Advanced Semiconductor Packaging 2024-2034", which encapsulates their in-depth analysis and insights into the rapidly evolving landscape of 3D semiconductor packaging... Read More

IDTechEx's latest report, "Flexible Hybrid Electronics 2024-2034," delves into the burgeoning realm of Flexible Hybrid Electronics (FHE). With a forecasted market size of approximately US$1.8 billion by 2034, this innovative manufacturing methodology combines the best of printed and co... Read More

IDTechEx provides insights on future RDL materials in its "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report. As the need for enhanced performance and effectiveness in electronic devices continues to rise, the semiconductor sector consistently strives to expan... Read More

Smart packaging integrates small, low-cost electronics, bringing the sensing, identifying, and communicating capabilities associated with electronics to a new realm. This promises benefits such as item-level tracking and traceability, freshness monitoring, improved consumer engagement, and quality a... Read More

IDTechEx, a leading market research and consulting firm, has released a comprehensive report titled "Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets," which delves into the advancements and potential of printed and flexible electronics. This alternative appro... Read More