Latest PCB (Printed Circuit Board) News | Page 125

IPC, the global association helping OEMs, EMS, PCB manufacturers and suppliers build electronics better, has announced the release of the IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs) standards.The newly released Revision A is a complete overhaul of I... Read More

Lockheed Martin spin-out company, Kuprion Inc, has introduced ActiveCopper™ Filled Thermal Vias, leveraging a patented technology breakthrough that addresses the increased reliability demands of heat and power dissipation for complex, advanced high-performance systems.Lead-free and RoHs-compli... Read More

National Circuit Assembly (NCA), a U.S.-based electronic manufacturing partner to entrepreneurs and OEMs nationwide, has announced its merger with Texas-based design and sourcing firm, Austin Circuit Design. The merger will help NCA expand its capabilities to include design and sourcing.Since 2006, ... Read More

Panasonic Corporation announced that its Industrial Solutions Company has commercialized R-5410; a halogen-free, ultra-low transmission loss Multi-Layer Circuit Board (MLCB) material suitable for millimeter-wave antennas. Mass production will begin in March 2021.The millimeter-wave radar is a key te... Read More

Global PCB supplier, NCAB Group has announced the acquisition of 100% of shares of Italian PCB supplier, PreventPCB. Based in Vergiate outside Milano in Italy, PreventPCB is one of the leading PCB suppliers in Italy and also serves customers in Switzerland. Prevent is serving customers in the HMLV (... Read More

The Semiconductor Industry Association (SIA) Board of Directors, comprised of CEOs and senior executives at leading U.S. chip companies, have sent a letter to the new US President, Joe Biden, urging him to include substantial funding for semiconductor manufacturing and research in the administration... Read More

Changing technologies, advanced materials and new processes that are driving the electronics manufacturing industry will take center stage throughout the IPC APEX EXPO 2021 technical conference and professional development sessions, which will take place virtually March 8-12.This year’s techni... Read More

Indium Corporation will showcase the Durafuse LT, its innovative high-reliability, low-temperature alloy system, during the virtual IPC APEX Expo, that will be held from 8th - 12th March, 2021. Durafuse LT is a novel, low-temperature alloy system designed to provide high-reliability in low... Read More

Inpixon, an Indoor Intelligence company, has announced its next-generation chirp RTLS anchor board, delivering significantly reduced size, newly integrated antennas, and more robust operating temperature tolerances than the previous generation. Designed to be advanced yet affordable, Inpixon's l... Read More

Keysight Technologies Inc has introduced the new i7090 massively parallel board test system to enable higher throughput in a smaller footprint. This is a new category of automated test equipment designed to perform tests in parallel, on multiple Printed Circuit Board Assemblies (PCBA), to achieve hi... Read More

IPC, under its IPC Factory of the Future standards, has announced the release of International Standard for Digital Twins - IPC-2551. This first international standard is comprised of digital twin product, manufacturing, and lifecycle frameworks. Using this standard, any manufacturer, design organiz... Read More

TTM Technologies, Inc., a leading global PCB and radio frequency (RF) components manufacturer, has announced its results for the fourth quarter of fiscal 2020, which ended on December 28, 2020.  Fourth Quarter 2020 HighlightsNet sales were $523.8 millionGAAP net income of $39.0 million, or $0.3... Read More

Due to the pandemic and its effects, the EMV 2021 trade fair and parallel workshops are set to take place digitally. The event is designed to once again give the EMC community a platform for exchange. The event period has also been extended to encompass the entire week from 22 to 26 March 2021. This... Read More

Amphenol RF has announced the release of new right angle PCB connectors, the AUTOMATE Mini-FAKRA Connector Series, the latest in automotive interconnect technology. This series offers a space-conscious, high-performance interface that is critical to the next generation of vehicle applications. Suppo... Read More

Ventec UK has announced that its European headquarters in Leamington Spa, UK continues to maintain highest AS9100 Revision D compliance in accordance with the Aerospace Supplier Quality System Certification Scheme following successful completion of its surveillance audit.Ventec's  loca... Read More

Liquid Wire Inc announced that it has joined the NextFlex community whose mission is to advance US manufacturing of Flexible Hybrid Electronics (FHE) by fostering technology innovation and commercialization. The current NextFlex project to identify reliable stretchable conductor systems utilize... Read More

Zero Defects International [ZDI] has recently received notice of compliance with and renewed registration for ITAR, the International Traffic in Arms Regulations.This continuation of its conformance status enables users of each of two ZDI services to benefit from their availability.  The f... Read More

IPC has released the December 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program, with the book-to-bill ration standing at 1.05. The total North American PCB shipments in December 2020, according to the report, were up 4.5 percent compared to the same month last ye... Read More

High Density Packaging (HDP) User Group has announced that Nippon Denkai has become its newest member. Nippon Denkai develops and produce ultrathin, high ductility copper foils for fine pitch wirings and substrate resins in the semiconductor industry. “Nippon Denkai is excited to be a member o... Read More

Nano Dimension Ltd. is offering quick solutions and easy access to complex PCBs and 3D printed electronics. Its unique and novel technology allows for rapid prototyping and production of high-performance electronic devices (Hi-PEDs).Nano Dimension offers two solutions:DragonFly LDM® 3D-printing ... Read More