Latest PCB (Printed Circuit Board) News | BGA | Page 3

Raytheon, an RTX business, has been awarded a $20 million contract through the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation multi-chip package for use in ground, maritime and airborne sensors.Under the contract, Raytheon wi... Read More

Two Indium Corporation experts are set to deliver technical presentations on low-temperature soldering at the upcoming Pan Pacific Strategic Electronics Symposium (Pan Pac), hosted by SMTA from January 29–February 1, 2024, in Hawaii.At 1 p.m. local time on January 30, the R&D Manager of th... Read More

INSPECTIS’ popular BGA inspection system can now be supplied with optional new XM lenses that offer up to 285x screen magnification, compared to the original standard lens with 200x. The INSPECTIS BGA lens package consists of a lens (standard or XM) plus a probe tip (standard or smal... Read More

Kurtz Ersa announced the introduction of the MOBILE SCOPE optical inspection system, a compact and portable video microscope designed for fast inspection of hidden solder joints, addressing critical quality control needs in the industry. The MOBILE SCOPE boasts a hand-guided system for swift examina... Read More

AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show. NC259FPA is a zero halogen paste engineered for p... Read More

MacDermid Alpha has launched a new next-generation ultra-low voiding solder paste - the ALPHA OM-362. This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). The design characteristics of BTCs create void removal challeng... Read More

PDR Rework, a leading manufacturer of BGA rework systems, announce the release of its groundbreaking software, ThermoActive Suite v.8. This latest advancement represents a significant leap in the field of rework, offering unparalleled simplicity and efficiency.ThermoActive Suite v.8 by PDR Focused I... Read More

In a groundbreaking development for the electronics manufacturing industry, Kurtz Ersa, a leading innovator, introduces the Ersa MOBILE SCOPE, an advanced optical inspection system designed for fast and precise examination of hidden solder joints. This hand-guided system, equipped with cutting-edge ... Read More

Shenmao America has introduced a range of low-temperature solder (LTS) materials in response to the growing demand for ultra-thin packages in the electronics industry. With the increase in package thinness, the challenge of package warpage and its impact on production yield has become more pronounce... Read More

VVDN Technologies, with its world-class manufacturing facilities, provides clients with full turnkey solutions for their products and production needs. The fully automated high-speed PCB assembly lines are capable of assembling complex boards with components including BGAs, uBGA’s, PLCC, FPGA,... Read More

AIM announced the release of its newest no clean, halogen-free solder paste, H10. H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste.H10 solder paste is capable of transfer efficiency >... Read More

Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new machine doubles the existing in-line reflow oven capacity to meet increasing customer demand for high-volume BGA component re-balling applications. The BGA ... Read More