Solder Paste Automating Preparation Practices

The first session of the SMI 2026 Webinar Series examines the critical role of solder paste preparation and control in achieving consistent SMT manufacturing results. The webinar explores how variables such as mixing practices, storage conditions, temperature management, and material handling can influence solder paste viscosity, stencil printing performance, defect rates, and downstream reflow outcomes. Attendees will gain insight into the factors that contribute to paste variability and the importance of establishing standardized procedures before the material reaches the printer. The session will also discuss viscosity measurement methods, including the evaluation of both static and dynamic viscosity, to help assess paste readiness under production conditions. In addition, the webinar will review opportunities for automating paste preparation processes and implementing process control strategies aimed at reducing operator-dependent variations and improving print consistency in SMT production environments.