AWR/Celsius In-Design Thermal Analysis Workflow: MMIC PA on PCB Example

The Cadence® AWR Design Environment® platform integrates electromagnetic (EM) and multiphysics analysis tools to support greater simulation accuracy and reduced development cycles for RF and microwave components and systems. Thermal analysis is now possible through the integration of the Cadence Celsius™ Thermal Solver within the AWR® platform. This application note showcases the AWR/Celsius in-design thermal analysis workflow for a monolithic microwave IC (MMIC) power amplifier (PA) on a PCB.