Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads.

  •  Tsinghua University
Fatigue Damage Behavior of a Surface-mount Electronic Package Under Different Cyclic Applied Loads.

This paper studies and compares the effects of pull–pull and 3-point bending cyclic loadings on the mechanical fatigue damage behaviors of a solder joint in a surface-mount electronic package.

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