Four Ways to Improve the Solderability of Your Next Design
This X-Ray image shows vias in pads in a Ball Grid Array Device. The board was soldered part-side-up and is shown part-side-down, with the BGA part beneath the vias in this image. Once the solder enters a liquid phase, cohesive forces and gravity combine to draw the liquid solder into the via cavity. Without an adequate amount of solder at the surface, the copper pads on the PCB will not properly bond to the BGA pads.
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