Highly Reliable Via-In-Pad Design
Via-In-Pad (VIP) is rapidly becoming more commonly used in modern printed circuit design due to the ever decreasing pitch of component footprints, along with the need to miniaturize PCB form factor. Signal routing may now be accomplished in as small an area of the board layout as possible, in many cases without escaping the perimeter of the device footprint (by via holes connecting to layers directly beneath the component).
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