Joule Heating Effects on the Current Carrying Capacity of an Organic Substrate for Flip-Chip Applications
Organic flip-chip packages are increasingly being used for high performance ASIC and microprocessor applications [1]. Electrical performance enhancements [2], interconnect reliability [3], and cost are the primary reasons for choosing organic substrates. Recently, [4, 5] showed that the thermal performance of flip chip packages with organic substrates can be on par or better than packages with ceramic substrates.
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