Significant Reduction in QFN Voids with I/O Pad Overprinting
This technical article explores an unconventional yet promising technique for reducing QFN voiding in surface mount technology (SMT) manufacturing. By shifting the focus from the ground pad to the I/O (Input/Output) pads of the QFN package, this method not only offers a fresh perspective on mitigating voiding issues but presents a cost-effective solution without adding complexity to the solder assembly process.
Explain your requirement *
Our Newsletters keep you up to date with the PCB Industry
Our Newsletters keep up to date with the PCB Update
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Note: File Size should be less than 10MB.
This action is permanent and cannot be undone.
File Type:
File Size:
Downloading...Please wait.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Create an account on PCB Directory to get a range of benefits.
Login to PCB Directory to download datasheets, white papers and more content.
OR
