Ultra-thin base materials take PCB miniaturisation to the next level

New approaches are needed to meet the increasing demand for smaller and thinner electronic devices. Both rigid and flexible ultra-thin base materials for PCBs can fill this need by enabling higher-density designs with enhanced miniaturization in the Z direction, leaving more space for other components or reducing the overall thickness of the device. Because these materials require specific design approaches and fabrication technology, it’s important to collaborate with a PCB manufacturer that has advanced engineering services to ensure a PCB design that is compact, costeffective and reliable.