When to Request a Custom Reflow Profile

The solder paste composition primarily defines the time/temperature graph or thermal profile of a reflow process. Therefore, as long as a specific solder paste is in use, the thermal profile remains relatively the same. For instance, the industry uses two types of standard reflow profiles—one for PCBs using leaded solder, and the other for PCBs using lead-free solder. However, it may be necessary to limit the temperature excursion on the higher side to protect SMD components on the PCB from damage, and on the lower side to obtain reliable soldering.