AdvancedPCB Highlights Laser-Drilled Microvia Capabilities for High-Density PCB Designs

AdvancedPCB Highlights Laser-Drilled Microvia Capabilities for High-Density PCB Designs712370

AdvancedPCB has highlighted its capabilities in laser-drilled microvia technology, underscoring its continued investment in advanced manufacturing processes for high-density and mission-critical printed circuit board applications. The company provides PCB manufacturing services ranging from simple prototypes to complex, high-layer-count designs for demanding and high-volume production environments.

AdvancedPCB Highlights Laser-Drilled Microvia Capabilities for High-Density PCB Designs

Contact AdvancedPCB to learn more.

Over the years, AdvancedPCB has made substantial capital investments in state-of-the-art equipment across its three manufacturing facilities. These investments enable the company to deliver advanced PCB technologies, including laser-drilled microvias, while maintaining high standards of quality, reliability, and process control.

Microvias are a key feature of High Density Interconnect (HDI) PCBs and play a critical role in modern electronics, where space constraints and performance requirements continue to increase. Defined by a low aspect ratio - the relationship between the depth of the hole and its diameter - microvias are extremely small interconnections created using laser drilling. They allow precise electrical connections between PCB layers while supporting compact layouts and improved signal integrity.

In addition to laser-drilled microvias, AdvancedPCB’s manufacturing capabilities include stacked microvias, blind and buried vias, laser direct imaging (LDI), via-in-pad designs, and multilayer boards with up to 40 layers. The company also supports specialized requirements such as buried chip resistors, cavity boards, and complex multilayer RF designs.

AdvancedPCB manufactures HDI structures in accordance with IPC-2226 standards, supporting multiple HDI configurations. These include Type I designs with laser microvias on both sides of the board, Type II designs that combine laser microvias with buried vias in the core, and Type III designs featuring multiple layers of laser microvias on each side, with optional buried vias.

By offering a broad range of HDI and microvia solutions, AdvancedPCB continues to support customers developing compact, high-performance electronic systems across industries where advanced PCB technology is essential.

Click here to learn more about laser-drilled microvias from AdvancedPCB.

AdvancedPCB Highlights Laser-Drilled Microvia Capabilities for High-Density PCB Designs

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