BEST Inc. Provides X-Ray Inspection for PCB Assembly Quality Control

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BEST Inc. provides X-ray inspection for PCB manufacturing processes, supporting inspection of area array packages such as CGAs, BGAs, CSPs and LGAs through transmissive X-ray imaging to verify rework and initial PCB assemblies and identify anomalies.

X-ray imaging is used as an analytical tool in SMT PCB manufacturing. BEST performs X-ray inspection to verify that PCB assemblies meet industry acceptance criteria and to support quality control in BGA rework processes through high resolution, high magnification and high contrast imaging.

X-ray imaging, when operated by trained technicians interpreting results, can detect multiple processing issues. Shorts are identified using X-ray inspection, including cases on double-sided boards where components from the secondary side may appear as solder bridges; rotating the board along the X and Y axis allows proper inspection and identification of non-common conductors connected via solder. 

Potato chipping occurs when a component’s outside edge lifts from a pad, causing flattened and non-uniform center joints due to overheating; this defect can be identified by rotating the board to observe the hourglass appearance of solder joints.

Voids result from improper reflow profiles that trap flux gasses; inspection involves lower voltage and amperage while the board lies flat, with analysis software used to determine void percentage and match IPC inspection criteria, including evaluation under leadless devices. 

Popcorning refers to breaking or delidding of the package top due to moisture, which may break the die, pull wire bonds, or delaminate the substrate; X-ray inspection helps determine whether this defect has occurred.

X-ray inspection supports detection of these conditions and is applied as part of PCB inspection processes.

Click here to learn more about this service.