Blind Buried Circuits Manufactures High-Frequency PCBs for RF and High-Speed Communications

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Blind Buried Circuits Inc provides high-frequency PCB manufacturing for high-speed communications, telecommunications, and RF microwave technology, supporting signal transmission requirements up to 100 GHz depending on material selection.

Blind Buried Circuits Inc manufactures high-frequency and high-speed circuits using materials with lower dielectric constant (Dk), lower dissipation factor (Df), and low coefficient of thermal expansion, enabling transmission of electromagnetic waves with minimal signal loss. 

The company works with high-frequency PCB materials based on application requirements, operating frequency, and layer stack-up, including Rogers, Nelco, Megtron, FR408 HR, and Teflon, while also supporting alternate material selection based on design needs and availability. FR4 substrates are limited to frequencies up to 1.6 GHz, while materials such as Rogers, Nelco, Megtron, and Teflon offer lower Dk, Df, and water absorption for higher-frequency performance. For frequencies above 10 GHz, the company uses specialized substrates including Teflon, with suppliers including Arlon, Taconic, Nelco, Isola, Rogers, and Teflon.

Blind Buried Circuits Inc provides PCB fabrication capabilities for RF and microwave applications using materials such as Rogers 4350B, 4003C, 4450F, and 4835. Manufacturing specifications include outer layer trace and spacing of 2.5 mils/2.5 mils standard and 2 mils/2 mils advanced, with line tolerances of +/-15% standard and +/-8% advanced. Inner layer trace and spacing are 2 mils/2 mils standard and 1.5 mils/1.5 mils advanced, with line tolerances of +/-10% standard and +/-8% advanced.

Board dimensions include minimum finished board size of 0.2" x 0.2" standard and 0.15" x 0.15" advanced, maximum board thickness of 0.260" (+/-10%) standard and 0.280" (+/-8%) advanced, and minimum board thickness of 0.007" (+/-10%) standard and 0.005" (+/-10%) advanced. Lamination capabilities range from 1 layer to 50 layers standard and up to 60 layers advanced.

Surface finish options include HASL with selective hard gold, selective ENIG with OSP, ENIG (nickel/gold) from 80–200 µ"/2–9 µ" standard and 250 µ"/10 µ" advanced, immersion silver (6–18 µ"), hard gold for tabs (10–80 µ"), immersion tin (30 µ" minimum), ENEPIG (Ni/Pd/Au) from 125 µ"/4 µ"/1 µ" minimum standard and 150 µ"/8 µ"/2 µ" minimum advanced, and soft gold (nickel/gold) from 200 µ"/20 µ" minimum.

Solder mask thickness is 0.4 mils minimum standard and up to 2 mils maximum advanced, with solder dam width of 4 mils standard and 3 mils advanced. Silk screen specifications include minimum space to SMD pad of 6 mils standard and 4 mils advanced, minimum stroke width of 6 mils standard and 5 mils advanced, minimum space to copper pad of 6 mils standard and 4 mils advanced, maximum width of 28 mils, and available colors including white, black, yellow, red, blue, and green.

Electrical testing capabilities include up to 30,000 test points, smallest SMT pitch of 18 mils (0.45 mm) standard and 12 mils (0.3 mm) advanced, and smallest BGA pitch of 12 mils (0.3 mm) standard and 6 mils (0.15 mm) advanced, with testing methods including AOI, flying probe test, bed of nails, and high potential testing up to HP-1000V. Impedance control is supported with +/-10% tolerance standard and +/-5% tolerance advanced for single-ended and differential configurations.

Special processes include via tenting, plugging and filling using solder mask, non-conductive epoxy, microvia filling, and conductive copper pastes, along with peelable solder mask, carbon ink, gold fingers (gold-plated connectors), and edge plating including castellations and controlled depth cavities.

The company supports industries including advanced communication systems, military, radar systems, medical systems, pressure measurement systems, 3D printing, power systems such as solar panels and inverters, marine systems including submarines and ships, and automotive applications including LiDAR-based systems.

Click here to learn more about the high-frequency PCB manufacturing.