Cicor Offers Flexible Printed Circuit Boards with Ultra-High Density Interconnect (HDI)

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Cicor Technologies is offering its latest innovation in flexible printed circuit boards (FPC), heralding a new era of 3D miniaturization. With an emphasis on ultra-high density interconnect (HDI) and remarkably low bending radii, these FPCs are poised to redefine the landscape of device integration.

Cicor, a stalwart in the industry, boasts years of dominance in this domain, offering flex circuits with a layer count ranging from 1 to 8. Leveraging polyimide foils as thin as 12.5 µm (0.5 mils) and adhesive bond plys starting at a thickness of 12.5 µm (0.5 mils), the company's cutting-edge manufacturing equipment ensures high output, reliability, and repeatability.

One of the key highlights of Cicor's FPCs lies in their miniature laser-drilled blind vias, which can be as small as 30 µm (1.4 mils) in diameter, paving the way for stacked vias and via-in-pad structures. Furthermore, the integration of leading-edge alignment methods facilitates the realization of intricate multilayer FPCs with minimal annular rings and precise solder mask registration, even on the most complex designs.

The versatility of Cicor's FPCs extends to the option of utilizing cover layer foils, while all standard surface finishings can be applied to accommodate various assembly methods. Moreover, the implementation of high-precision laser contour cutting ensures optimal space utilization, with radii as small as 0 µm, thus enabling unparalleled 3D miniaturization for customers.

As industries continue to demand smaller, more efficient solutions, Cicor Technologies Ltd stands at the forefront, driving innovation and shaping the future of electronic design with its revolutionary flexible printed circuit boards.